Thermal conduction and thermal stress analysis
Visualize the temperature distribution and verify issues caused by heat in advance.
Temperature distribution analysis is a numerical evaluation method for temperature changes and heat transfer within components and structures. Our company uses the finite element method (FEM) to analyze heat conduction from heat sources, heat dissipation effects, temperature distribution, and more, to conduct thermal design and structural integrity assessments. It can be utilized for understanding temperature rise, evaluating heat dissipation performance, and examining thermal deformation.
- 企業：構造計算テクノロジー
- 価格：Other
